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WLCSP-156, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package.

• -3.442513e-04 vertex -1.001369e+02 1.055465e+02 2.655000e+01 facet normal.
• Holes 63.5mm, distance of mounting.
• Row_2 = row_1 + vertical_space/7; row_3 .
• -5.38893 1.02637 21.833 vertex 4.44467 3.03604 21.8214 vertex.
• Connect Type059_RT06302HBWC, 2 pins, diameter.

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