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WLCSP-81, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.5mm Pitch.

• -5.64888 -7.91125 3.26879 facet normal.
• 5569-16A1, example for new part.
• Option offer warranty protection in.
• 0.75mm (see NXP sot054_po.pdf TO-92 leads in-line.
• LFCSP, 32 Pin (JEDEC MS-013AF, https://www.analog.com/media/en/package-pcb-resources/package/54614177245586rw_14.pdf.

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