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Murata MGJ2DxxxxxxSC, 19.5x9.8x12.5mm, 5.2kVDC Isolated, 1W, dual output, SIP package style, https://power.murata.com/data/power/ncl/kdc_mej1.pdf Abracon Miniature Ceramic Smd Crystal ABM3 http://www.abracon.com/Resonators/abm3.pdf, 5.0x3.2mm^2 package SMD Crystal Seiko Epson MC-505 http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf, hand-soldering, 12.7x5.1mm^2 package SMD Crystal MicroCrystal CC7V-T1A/CM7V-T1A series http://www.microcrystal.com/images/_Product-Documentation/01_TF_ceramic_Packages/01_Datasheet/CC1V-T1A.pdf, hand-soldering, 3.2x1.5mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002CE https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC, 3.2x2.5mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002JA https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC, hand-soldering, 7.0x5.0mm^2 package Miniature Crystal Clock Oscillator (XO) (https://www.diodes.com/assets/Datasheets/FN_3-3V.pdf Oscillator Crystal SMD SMT mems oscillator Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.8mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf VFBGA-49, 7x7, 5x5mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4x4mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4x4mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, RWH0032A, 8x8x0.9mm (http://www.ti.com/lit/ds/snosd10c/snosd10c.pdf DFN, 10 Pin.

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