Labels Milestones
BackIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package.
New Pull RequestIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package.
New Pull Request