synth_tools

Back

Tactile Switch, http://www.helloxkb.com/public/images/pdf/TS-1187A-X-X-X.pdf Ultraminiature Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-7810245, 2 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-36DS-0.5V, 36 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TDFN, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST CTS_Series194-2MSTN, Piano, row spacing 5.9 mm (232 mils), body size 10.8x11.72mm 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST Copal_CHS-04B, Slide, row spacing 9.53 mm (375 mils 14-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 10x-dip-switch SPST Omron_A6H-10101, Slide, row spacing 8.9 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 8x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 24-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 2x-dip-switch SPST Copal_CHS-02A, Slide, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 42-pin zero insertion force socket, through-hole, row spacing 6.73 mm (264 mils), body size 10.8x21.88mm 8x-dip-switch SPST Omron_A6H-8101, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket 20-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24 FBGA-78, 10.5x8.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=27 FBGA-96, 14.0x8.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930.

New Pull Request

Labels Milestones