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Board between R25 and R1, probably a result of switching.

• Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE.
• (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP.
• Size 52.5x7.6mm^2 drill 1.2mm pad 3mm Terminal.

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