Labels Milestones
BackDSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition.
- 0.0993312 vertex -9.92115 1.25333 0 vertex.
- 173.6675 111.03 (end 181.12.
- 1x01 1.27mm single row style2 pin1.
- 3.143723e-003 2.095952e-001 vertex -4.012057e+000 1.591300e+000 2.470218e+001 facet.
- Phoenix PT-1,5-9-5.0-H, 9 pins, pitch 5.08mm, size 71.1x9.8mm^2.