Labels Milestones
BackTemps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes are merged with plated holes count 16 ============================================================= Total unplated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file View File 3D Printing/Cases/Eurorack Modular Case/EuroRack_Case_End_Male.png Executable file View File KICKDRUM_MANUAL.pdf Normal file View File From abdd18d8f0f754e290e642eee419b44f1d840471 Mon Sep 17 00:00:00 2001 Subject: [PATCH] More assembly notes - C1: enlarge footprint; a box film cap instead of A4 Updates from real TL0x4s // Joy of Tech // Joy of Tech elseif (strpos($article['link'], 'gunnerkrigg.com/?p') !== FALSE) { // Invisible Bread (make the bread visible if (preg_match("@.*(
-
X="4.5" y="2.1"/>
Normal 1.257392e-01 7.007453e-03 -9.920386e-01 facet normal 6.244133e-002 -1.055689e-001. - Normal -3.508287e-001 -6.139494e-001 7.070965e-001 facet normal 0.297059 0.243768.