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1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 24 leads; body width 4.4 mm; thermal pad with vias HTSSOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc8246.pdf#page=263), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-04P-1.25DSA, 4 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Resistor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator JST PH series connector, S15B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Net tie, 4 pin, 2.0mm square SMD pads Net tie, 3 pin, 2.0mm square SMD pads Net tie, 4 pin, 0.5mm square SMD pads Net tie, 2 pin, 0.5mm square SMD pads Net tie, 3.

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