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Submodules avoid non-circular holes in footprints whenever possible; some fabs charge more for ovals avoid non-circular holes in footprints whenever possible; some fabs charge more for ovals - make power connection traces larger; MK uses .6mm this means from the IDC through the board, connecting a trace on one side to center of package, Thorlabs photodiodes TO-46-3, Pin2 at center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm.

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