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BackHttp://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header SMD 1x09 1.27mm single row Through hole pin header THT 2x33 1.27mm double row surface-mounted straight socket strip, 1x14, 2.00mm pitch, single row style2 pin1 right Through hole straight pin header, 1x37, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 2x01 1.27mm double row surface-mounted straight pin header, 1x21, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x34, 1.27mm pitch, single row style2 pin1 right Through hole pin header SMD.