Labels Milestones
Back0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x15 1.00mm double row Through hole pin header THT 1x07 1.00mm single row style2 pin1 right Through hole IDC header, 2x12, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 2x19, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x18 2.54mm single row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x07 2.00mm single row style2 pin1 right Through hole straight pin header, 2x31, 2.54mm pitch, 8.51mm socket length, double rows Through hole socket strip SMD 1x17 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x09, 1.27mm pitch, double.
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