3
1
Back

SO package 20pin without exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF WDFN, 12 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=62), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 24 Pin (http://pdfserv.maxim-ic.com/package_dwgs/21-0139.PDF), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator.

New Pull Request