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Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x33 1.00mm single row Through hole pin header SMD 1x29 1.00mm single row Through hole angled pin header, 2x14, 1.00mm pitch, double rows Through hole angled socket strip SMD 1x32 1.00mm single row style2 pin1 right Through hole vertical IDC header THT 1x27 2.54mm single row (from Kicad 4.0.7), script generated Through hole.

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