Labels Milestones
BackDip package, row spacing 7.62 mm (300 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm.
- Size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile.
- -7.13918 -0.0610838 6.87866 facet normal 0.471399 -0.88192 -4.52508e-06.
- IRM-02, THT, https://www.meanwell.co.uk/media/productPDF/IRM-02-spec.pdf ACDC-Converter.