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UCBGA-81, 9x9 raster, 4x4mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf WLCSP-143, 11x13 raster, 4.539x5.849mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.553x2.579mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf WLCSP-49, 7x7 raster, 3.294x3.258mm package, pitch 0.5mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 506BU.PDF 8-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 44 leads; body width 4.4 mm; Exposed Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [TQFP] With Exposed Pad Variation BB; (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic.

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