Labels Milestones
BackWSON-10 package 2x3mm body, pitch 0.5mm, thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-12P-1.25DSA.
- Samtec HPM power header series 11.94mm.
- Phoenix PT-1,5-11-3.5-H, 11 pins.
- (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=634), generated with kicad-footprint-generator Molex CLIK-Mate series.
- 2.29x2.54mm pin-PCB-offset 9.4mm 37-pin D-Sub connector, horizontal/angled (90.