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Connector, S4P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89018xx, 18 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 14110713010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WQFN, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices KS-4 (like EIAJ SC-82 Infineon PG-HDSOP-10-1 (DDPAK), 20.96x6.5x2.3mm, slug up (https://www.infineon.com/cms/en/product/packages/PG-HDSOP/PG-HDSOP-10-1/ HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-3/ Infineon PG-TO-220-7, Tab as Pin 8, see e.g. Https://www.infineon.com/dgdl/Infineon-BTS50055-1TMC-DS-v01_00-EN.pdf?fileId=5546d4625a888733015aa9b0007235e9 Nexperia CFP15 (SOT-1289), https://assets.nexperia.com/documents/outline-drawing/SOT1289.pdf On Semiconductor ECH8, https://www.onsemi.com/pub/Collateral/318BF.PDF Low Profile 8x8mm PQFN, Dual Cool 88, https://www.onsemi.com/pub/Collateral/FDMT80080DC-D.pdf TO-50-4 Power Macro Package Style M238 TO-252 / DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-7-1/ D2PAK DDPAK TO-263 D2PAK-7 TO-263-7 SOT-427 TO-263 / D2PAK / DDPAK SMD package, tab to pin 1 x 1 mm, 734-180 , 20 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.25 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.75 mm² wire, reinforced insulation, conductor diameter 1.4mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py WSON6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Stretched Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 11x-dip-switch SPST , Piano.

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