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ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 40-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 32-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 10x-dip-switch SPST KingTek_DSHP10TS, Slide, row spacing 22.86 mm (900 mils), Socket 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x9.18mm 3x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 20-pin zero insertion force socket, through-hole, row spacing 8.61 mm (338 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 8x-dip-switch SPST Copal_CVS-08xB, Slide, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 48-lead though-hole mounted DIP package.

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