Labels Milestones
Back+ NFC module Modtronix Wireless SX1276 LoRa Module (http://modtronix.com/img/prod/imod/inair9/inair_dimensions.gif Modtronix LoRa inAir inAir9 SX1276 RF 915MHz 868MHz Wireless RAK811 LPWAN Module https://downloads.rakwireless.com/LoRa/RAK811/Hardware_Specification/RAK811_LoRa_Module_Datasheet_V1.4.pdf RAK4200 LPWAN Module https://downloads.rakwireless.com/LoRa/RAK811/Hardware_Specification/RAK811_LoRa_Module_Datasheet_V1.4.pdf RAK4200 LPWAN Module https://downloads.rakwireless.com/LoRa/RAK4200/Hardware-Specification/RAK4200_Module_Specifications_V1.4.pdf Class 2 Bluetooth Module without antenna Low-Power Long Range Transceiver Module SMD-16 (https://www.hoperf.com/data/upload/portal/20181127/5bfcbea20e9ef.pdf LoRa Low Power Long Range Transceiver Module LoRa Radio, RF, Module, http://www.hoperf.com/upload/rf/RFM69HW-V1.3.pdf 8 pin package (http://datasheet.octopart.com/ZDT6758TA-Zetex-datasheet-68057.pdf Diodes Incorporated (https://www.diodes.com/assets/Package-Files/U-DFN2510-10-Type-CJ.pdf U-DFN2020-6 (Type F) (https://www.diodes.com/assets/Package-Files/U-DFN2020-6-Type-F.pdf HVQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM13B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0180, 18 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, B15B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-136-02-xxx-DV-LC, 36 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-11P-1.25DS, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 2mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator.
- M100 MBGA 121-ball, 0.8mm BGA.
- Connector, SM10B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Samtec HLE.
- 100644 Hardware/PCB/precadsr/ao_tht.pretty/DPDT-toggle-switch-1M-seriesx.kicad_mod create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/PinHeader_1x10_P2.54mm_Vertical.kicad_mod delete mode.
- Dual LED, 3.5 x 2.8.