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BackLead surface package SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 18 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 20 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 44 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN, 4mm x 3mm MLF - 3x3x0.85 mm Body [QFN] with corner pads and trace routing to de-bodge the pots. 's notes on updating the fireball for rev 2 d89db83df1 revised README.md to rev 2 beta by adding +5V, and both trigger/gate and CV routing # Precision ADSR build notes | C7, C11 | 2 pin Molex header 2.54 mm spacing"/>