Labels Milestones
BackDiameter 13.8mm pitch 9mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf Resistor, LDR 5x4.1mm, see http://cdn-reichelt.de/documents/datenblatt/A500/A90xxxx%23PE.pdf Resistor, LDR 5.2x5.2, upright, see http://cdn-reichelt.de/documents/datenblatt/A500/M996011A.pdf Resistor, LDR 5.1x3.4mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf Sharp OPIC IS471F, see http://pdf.datasheetcatalog.com/datasheet/Sharp/mXvrzty.pdf Sharp OPIC, IS485, IS486, see http://microrato.ua.pt/main/Actividades/Estagios/Docs/IS485_6.pdf Sharp OPIC IS485 IS486 package for Kodenshi SG-105 with PCB locator, 15 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator Hirose series connector, S09B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator JST XH series connector, 53780-0570 (), generated with kicad-footprint-generator JST XA series connector, 53780-0670 (), generated with kicad-footprint-generator Wuerth WR-WTB series connector, 14110613002xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13002XXX_100228421DRW035C.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 4, Wuerth electronics 9774100951 (https://katalog.we-online.de/em/datasheet/9774100951.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat, No Lead Package - 3x3 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, with thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf LFCSP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2855-4)), generated with kicad-footprint-generator JST PH series connector, B13B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1130, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py.
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