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Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-6410, 64 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator Hirose series connector, BM24-40DP/2-0.35V (https://www.hirose.com/product/en/download_file/key_name/BM24/category/Catalog/doc_file_id/47680/?file_category_id=4&item_id=50&is_series=1 connector Hirose DF11 through hole, DF13-11P-1.25DSA, 11 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py DSO DSO-8 SOIC SOIC-8 Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias in pads, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-121-02-xxx-DV-BE-LC, 21 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 2.5/2-V-5.0-EX Terminal Block, 1991011 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1991011), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-36DS-0.5V, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-135-02-xxx-DV, 35 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 64-Lead Plastic Quad Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body with Exposed Pad Variation BB; (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 505AB (see ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [QFN]; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf VFBGA-49, 7x7, 5x5mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die.

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