Labels Milestones
BackThermally Enhanced Thin Shrink Small Outline Package (MS) [MSOP], variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506AH.PDF DFN, 6 Pin (https://www.onsemi.com/pdf/datasheet/ncp349-d.pdf#page=12), generated with kicad-footprint-generator.
- -1.000000e+00 -5.540166e-07 vertex -1.047207e+02 9.665134e+01 1.229235e+01 facet normal.
- -6.183045e-001 4.315173e+000 2.484855e+001 facet normal.