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Bump 3x3 array, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf QFN, 24 Pin (https://www.st.com/resource/en/datasheet/stp16cp05.pdf#page=25), generated with kicad-footprint-generator connector JAE side entry Harwin LTek Connector, 20 pins, surface mount SMD package Diotec Diotec MicroDil, body 3.0x3.0x1.8mm (e.g. Diode bridge), see http://www.vishay.com/docs/88854/padlayouts.pdf SMD diode bridge OnSemi SDIP-4L, see https://www.onsemi.com/pdf/datasheet/df10s1-d.pdf OnSemi Diode Bridge SDIP-4L SMD diode bridge Vishay KBL rectifier package, 7.5mm/10mm pitch, see http://www.vishay.com/docs/88655/kbl005.pdf Vishay KBL rectifier diode bridge Low Profile 8x8mm PQFN, Dual Cool 88, https://www.onsemi.com/pub/Collateral/FDMT80080DC-D.pdf TO-50-4 Power Macro Package Style M236 TO-50-4 Macro X Package Style M236 TO-50-4 Macro X Package Style M238 TO-252 / DPAK SMD package, http://www.icbank.com/icbank_data/semi_package/to268aa_dim.pdf D3PAK TO-268 D3PAK-3 TO-268-3 SMD package TO-269AA (e.g. Diode bridge), see http://www.vishay.com/docs/88854/padlayouts.pdf SMD diode bridge 9.0mm 8.85mm WOB pitch 5.08mm 2W length 11.9mm diameter 4.5mm Fastron LACC Inductor, Axial series, Axial, Horizontal, pin pitch=27.5mm, , length*diameter=22*10.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B300/STYROFLEX.pdf C Axial series Axial Horizontal pin pitch 5.00mm diameter 4.3mm width 1.9mm Capacitor C, Rect series, Radial, pin pitch=6.00*6.00mm^2, , length*width=11.5*11.5mm^2, Neosid, NE-CPB-11EN, Drill1.3mm, http://www.neosid.de/produktblaetter/neosid_Festinduktivitaet_NE_CPB11EN.pdf Inductor Radial series Radial pin pitch 5.08mm length 10mm width 2.5mm Capacitor C, Rect series, Radial, pin pitch=5.60mm, , length*width=13*6.5mm^2 L_Toroid Vertical series Radial pin pitch 14.70mm diameter 16.8mm Vishay IHB-1 Inductor, Radial series, Radial, pin pitch=10.00mm, , diameter=6.476999999999999mm, Diameter7-5mm, Amidon-T25 L_Toroid Horizontal series Radial pin pitch 7.50mm diameter 18mm Electrolytic Capacitor CP, Radial series.

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