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TO-220-7 Horizontal RM 5.45mm TO-3PB-3, Horizontal, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 1.7mm MultiwattF-11 staggered type-1 TO-220-4 Horizontal RM 5.08mm TO-220-2, Vertical, RM 1.27mm, staggered type-2, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf TO-220-5 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Horizontal RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 1.27mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 1.27mm MultiwattF-15 staggered type-1 TO-220F-7 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 0.9mm, staggered type-1 TO-220-9, Horizontal, RM 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-2 Vertical RM 5.45mm TO-264-3, Vertical, RM 2.54mm, staggered type-2 TO-220F-9 Vertical RM 5.45mm TO-3PB-3, Vertical, RM 1.27mm, MultiwattF-15, staggered type-2 TO-220F-15, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Vertical RM 5.08mm TO-220-2, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Vertical RM 2.54mm TO-220F-4, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil 2x-dip-switch SPST Copal_CHS-02A, Slide, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 225 0.8 CLG225.

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