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2x22 2.00mm double row Through hole straight socket strip, 2x02, 2.00mm pitch, 6.35mm socket length, double rows Surface mounted socket strip THT 1x06 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x06 2.54mm double row Through hole angled socket strip THT 2x13 2.54mm double row Through hole angled socket strip THT 2x08 1.00mm double row surface-mounted straight socket strip, 2x21, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 1x25, 1.27mm pitch, double rows Surface mounted socket strip SMD 1x25 2.00mm single row Through hole socket strip THT 2x27 1.27mm double row Through hole straight pin header, 2x09, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header, 2x40, 1.00mm pitch, double rows Through hole IDC header, 2x20, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 11.94mm post length THT 1x06 2.54mm single row Surface mounted socket strip SMD 1x26 2.54mm single row Through hole straight pin header, 2x35, 2.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 2x10 1.00mm double row Through hole angled pin header THT 2x40 1.27mm double row surface-mounted straight socket strip, 1x03, 2.54mm pitch, double rows Through hole angled pin header THT 2x23 2.54mm double row surface-mounted straight socket strip, 2x09, 2.54mm pitch, 8.51mm socket length, single row Through hole straight socket strip, 2x34, 1.27mm pitch, double rows Surface mounted pin header THT 2x10 2.00mm double row Through hole pin header, 2x12, 2.54mm pitch, double rows Through hole pin header THT 1x21 2.00mm single row 0.8 mm BGA-64, 10x10 raster, 9x9mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera BGA-153 M153 MBGA Altera BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_5x6mm_MF_C04210B.pdf), generated with kicad-footprint-generator JST EH series connector, B12B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, 50 top-side contacts, 1.0mm pitch.

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