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Package (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx) !PADS 4-5 DO NOT MATCH DATASHEET! Allegro MicroSystems, CB-PFF Package (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx) !PADS 4-5 DO NOT MATCH DATASHEET! Allegro MicroSystems, CB-PSS Package (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx Allegro MicroSystems, CB-PSS Package (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx Allegro MicroSystems, CB-PSS Package (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin (http://www.ti.com/lit/ds/sbos354a/sbos354a.pdf, JEDEC MO-220 variant VEED-6), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-03P-1.25DSA, 3 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 2 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A https://www.onsemi.com/pub/Collateral/488AA.PDF ON Semi DFN5.

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