3
1
Back

(Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 32-lead dip package, row spacing 15.24 mm (600 mils), Socket, LongPads.

New Pull Request