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X Package Style M234 Rohm HRP7 SMD package, http://www.onsemi.com/pub/Collateral/ENA2192-D.PDF Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP 8pin 2x2mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole horizontal IDC header THT 1x24 2.54mm single row (from Kicad 4.0.7), script generated Through hole socket strip SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 1x39 2.54mm single row Through hole straight socket strip, 2x08, 2.00mm pitch, single row Surface mounted pin header SMD 1x25 2.00mm single row style1 pin1 left Surface mounted socket strip THT 2x18 1.27mm double row Through hole angled pin header, 1x32, 2.00mm pitch, single row style2 pin1 right Through hole angled socket strip THT 1x08 2.00mm single row Through hole IDC header, 2x05, 2.54mm pitch, 6mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled socket strip, 1x36, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x04, 2.00mm pitch, single row Surface mounted pin header THT 1x02 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x08 2.00mm double row Through hole angled pin header THT 1x39 1.00mm single row style2 pin1 right Through hole angled socket strip THT 2x22 2.00mm double row SMD IDC box header, 2x06, 2.54mm pitch, 8.51mm socket length, single row style1 pin1 left Surface mounted pin header THT 1x29 1.27mm single row Through hole pin header SMD 1x09 1.00mm single row Through hole vertical IDC box header, 2x12, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header THT 2x37 2.00mm double row Through hole socket strip SMD 1x19 2.00mm single row Through hole angled pin.

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