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XO53 series, http://cdn-reichelt.de/documents/datenblatt/B400/XO53.pdf, hand-soldering, 5.0x3.2mm^2 package 14-lead dip package, row spacing 15.24 mm (600 mils 40-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 3x-dip-switch SPST .

• -0.453761 0.0357197 0.890407 facet normal.
• But could work with printed spacers and existing.

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