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WAGO 236-216, 45Degree (cable under 45degree), 5 pins, pitch 10mm, size 242x14mm^2, drill diamater 1.3mm, pad diameter 2.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, BM01B-ACHSS-A-GAN-ETF (http://www.jst-mfg.com/product/pdf/eng/eACH.pdf), generated with kicad-footprint-generator JST PHD series connector, B30B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 22-27-2031, 3 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000992393), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 56 Pin top tented version (manually modified). For information see: http://www.cypress.com/file/138911/download QFN, 56 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CB), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1410, with PCB locator, 2 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1130, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.25 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 1.7mm, outer diameter 2mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend.

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