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Pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias 10-Lead Plastic XDFN (1.35mm x 2.2mm) (see https://www.onsemi.com/pdf/datasheet/emi8132-d.pdf Thermally-enhanced SO-8 PowerPAK PQFN Q5A PowerFLAT LFPAK SOT669 WPAK(3F) LFPAK Power56 PMPAK PowerDFN56 HSOP8 PRPAK56 PDFN HVSON QFN, 24 Pin (JEDEC MO-153 Var JD-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 54722-0204, 20 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for a 1uF capacitor. 1uF may be necessary to make fitting inside a case easier. Or 10mm if it can fit; losing the bodge area. Don't put R8 so close to R26 -- D36/R47 too close From 812d609d12a788e600a582b2b6e7494f6d2b0728 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Documentation Docs/build.md | 4 .../precadsr-Edge_Cuts.gbr | 16 Docs/precadsr_bom.md | 71 Docs/precadsr_layout_back.pdf | Bin 0 -> 87811 bytes sr1_full.png | Bin 0 -> 16561 bytes create mode 100644 3D Printing/Pot_Knobs/scaled_french_pot.mix cube([board_width, board_height, thickness]); cylinder(thickness+standoff_height, r=standoff_radius, $fn=360); cylinder(h=thickness+standoff_height, r=standoff_radius, $fn=360); cube([cutout_width, cutout_height, thickness+3]); cylinder(h=thickness+standoff_height+3, r=hole_radius, $fn=360); vertex 0 7.49999 6.0001 vertex 2.87013 -6.92908 6.0001 vertex -6.23601 4.16678 6.0001 vertex 6.23601 4.16677 6.0001 vertex -2.87011 6.92909 6.0001 vertex 7.49999 0 6.0001 facet normal 6.869846e-01 7.266720e-01 -0.000000e+00 facet normal 3.010579e-01 9.536059e-01 5.927090e-05 vertex -9.541039e+01 1.058179e+02 4.255000e+01 facet normal -0.989339 0.0974657 0.108209 facet normal 0.547916 -0.449666 0.705399 vertex 8.10352 5.4146 3.26879 facet normal.

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