3
1
Back

Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf), generated with kicad-footprint-generator connector wire 0.1sqmm double-strain-relief Soldered wire connection with double feed through strain relief, for 4 times 0.15 mm² wire, reinforced insulation, conductor diameter 1.7mm, outer.

New Pull Request