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Back*.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes unplated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 Subject: [PATCH] revised README.md to rev 2 beta revised README.md to rev 2 beta master Binary files /dev/null and b/Panels/Font files/futura light bt.ttf | Bin.
- -0.124716 0.987214 0.0992685 facet normal -9.342429e-01 -3.566374e-01 0.000000e+00.
- (http://www.onsemi.com/pub/Collateral/NCP133-D.PDF), generated with kicad-footprint-generator Hirose DF11 through.
- MC_1,5/5-G-5.08; number of pins: 03; pin pitch: 3.81mm.