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Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil reed relay Standex-Meder SIL-relais, Form 1C, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_SIL.pdf Standex.

• 9.260606e+01 2.655000e+01 facet normal -0.847874 0.479685 0.225859 facet.
• -42dB, reflowable, electret condenser microphone.
• Board-to-Board, 38 Position, 24.003mm / .64mm [.945in] Centerline.

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