Labels Milestones
BackBGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.553x2.579mm package, pitch 0.8mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice.
- = .25; //non-printing, barely-visible outline of component footprints.
- 0.65P dual flag WDFN-8 1EP 2.2X2.0 0.5P WDFN.
- USB B receptable with flange, bottom-mount, SMD.
- = cone_indents_height + 2 * nothing.