Labels Milestones
Back8 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic Micro Small Outline (ST)-4.4 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf SIP4 Footprint for Mini-Circuits cas HZ1198 (https://ww2.minicircuits.com/case_style/HZ1198.pdf) following land pattern PL-079, including GND vias (https://www.minicircuits.com/pcb/98-pl176.pdf Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf) using land-pattern PL-052, including GND-vias (https://www.minicircuits.com/pcb/98-pl258.pdf Footprint for Mini-Circuits case QQQ130 (https://ww2.minicircuits.com/case_style/QQQ130.pdf) following land pattern PL-079, including GND vias (https://ww2.minicircuits.com/pcb/98-pl236.pdf Footprint for mini circuit case CD542, Land pattern PL-094, pads 5 and 6); middle of.
- 3.5mm, horizontal, through-hole, , circular holeshttps://www.cui.com/product/resource/sj1-353xng.pdf TRS.
- 7 segment green, https://docs.broadcom.com/docs/AV02-2553EN.