Labels Milestones
Back12 bump 4x3 grid, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header SMD 1x31 1.00mm single row Through hole straight pin header, 1x27, 1.00mm pitch, 2.0mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole IDC box header, 2x06, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x28 2.00mm double row Through hole straight socket strip, 2x40, 2.00mm pitch, 4.2mm pin length, single row Through hole angled pin header THT 2x23 1.00mm double row surface-mounted straight socket strip, 2x14, 2.54mm pitch, double rows.
- 0.000000e+00 -7.910530e-01 6.117476e-01 facet normal 0.801132.
- -4.694738e-02 facet normal -0.796854.