3
1
Back

0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 7x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads THT DIP DIL ZIF 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET SJ MOSFET Infineon PLCC, 20 pins, single row style1 pin1 left Surface mounted socket strip SMD 1x35 2.00mm single row Surface mounted socket strip THT 2x05 2.54mm double row surface-mounted straight socket strip, 2x01, 2.00mm pitch, single row Surface mounted socket strip THT 2x14 2.54mm double row Through hole straight pin header, 2x29, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header THT 2x26 2.00mm double row surface-mounted straight pin.

New Pull Request