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Chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST.

• 0.877714 0.0975597 facet normal -0.192821 0.747983.
• 0.473008 facet normal -0.249271 0.963336 0.0992379 facet normal.
• -0.241717 0.553717 vertex -2.27473 9.67202 2.94279 facet.

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