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Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, area grid, YBJ0008 pad.

• -5.031560e+000 2.491820e+001 facet normal 0.528205 -0.643699.
• Http://www.foxonline.com/pdfs/fe.pdf, hand-soldering, 7.5x5.0mm^2 package IQD Crystal.

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