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Back0.5 thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-02A example for new part number: 26-60-4090, 9 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0710, with PCB trace layout master PSU/Synth Mages Power Word Stun.kicad_pro Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/SolderWirePad_1x01_Drill0.8mm.kicad_mod Normal file View File Latest commits for file Synth_Manuals/Module Summaries.ods
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