Labels Milestones
BackSPST Omron_A6S-1010x, Slide, row spacing 7.62 mm (300 mils), Socket 12-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads THT DIP DIL ZIF 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 14-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier 4-lead round diode bridge DFS, see http://www.vishay.com/docs/88854/padlayouts.pdf SMD diode bridge DFS, see http://www.vishay.com/docs/88854/padlayouts.pdf SMD diode bridge package, diameter 8.9mm, pin pitch 10.00mm length 11.5mm width 7.5mm Capacitor C, Rect series, Radial.
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