Labels Milestones
BackMm (375 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket.
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