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BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted socket strip SMD 1x31 1.00mm single row style2 pin1 right Through hole socket strip SMD 2x26 2.54mm double row Through hole straight pin header, 2x06, 2.54mm pitch, double rows Through hole straight socket strip, 2x40, 2.00mm pitch, 4.2mm.

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