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Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_QFN_9x9_MR_C04-00149e.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF.

• M4 iso14580 Mounting Hole 6.4mm.
• -1.062577e+02 9.695134e+01 1.289971e+01 facet.
• -0.0600064 -0.144869 0.98763 facet normal -0.301372 0.0723665 0.950757.
• Normal 0.83125 0.555899 4.94372e-08.
• With Ground Terminal, without Boss Ultra-small-sized.

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