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Wide, 7.50 mm Body [TQFP] With Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [QFN] with corner pads and trace routing to de-bodge the pots. 6523065365c12ceda76dbda25c5041018c73eb63 's notes on updating the fireball for rev 2 beta edits README.md file 8976a63dc06fa25beedf8d2553931872c491047e adds README.md file again 605f29538db81c6c2eb02428332e653ea5ee7e41 edits README.md file - Before producing, confirm footprint dimensions for capacitors, diodes (inc. LEDs), and barrel power jack.

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