synth_tools

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Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 461, 4.63x4.15mm, 115.

And sot337-1_po.pdf SSOP16: plastic shrink small outline package.
MSTBV_2,5/3-GF; number of pins: 10; pin pitch: 5.00mm.
Vertex 5.069248e+000 -2.926364e+000 2.473857e+001 facet normal.

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