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BackMount, https://www.neutrik.com/en/product/nc4mbh B Series, 3 pole XLR female receptacle with 6.35mm (1/4in) mono jack without switching contact, horizontal PCB mount, https://www.neutrik.com/en/product/nc3mahr A Series, 5 pole male XLR receptacle, grounding: separate ground contact to mating connector shell and front panel, horizontal PCB mount, asymmetric push, https://www.neutrik.com/en/product/nc3fbv2-da B Series, 3 pole female XLR receptacle, grounding: separate ground contact connected to trigger, gate jack is normalized\nto +12 V, and sustain voltage is taken from \npot pin 1. Cmp-Mod V01 Created by Cvpcb (2015-03-25 BZR 5536)-product date = sam. 04 avril 2015 11:21:18 UTC update=Tue 20 Apr 2021 10:22:18 AM EDT Generated from schematic into main 3d279dd88c Finish schematic, add PDF Finish schematic, add PDF Fix for component clearance, panel thickness from printer realities Fix rail clearance = ~11.675mm, top and bottom railHeight = (threeUHeight-panelOuterHeight)/2; mountSurfaceHeight = (panelOuterHeight-panelInnerHeight-railHeight*2)/2; panelInnerOffset = (panelOuterHeight-panelInnerHeight)/2; echo("railHeight: ", railHeight); offsetToMountHoleCenterX = hp - holeOffset; // 1 for manual glide (rv16 // 1 for run/stop (sw14) // 1 to 4.9 milli Ohm (http://http://www.vishay.com/docs/30108/wsk.pdf Shunt Resistor SMD 0612 (1632 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, 502382-0970 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xxx-DV-LC, 30 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-0103, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 22x22 grid, 23x23mm package.
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